Power IC Ltd. (PIC) signed NDA with Energypac Electronics Ltd. (EPAC) for improving CFL(R&D).
Agreed that initially, PIC will work on CFL, Electronic Ballast and T5 Ballast to improve the quality and reliability. 
The two companies will engage in R&D activities with a bigger scope soon.
PIC provided the MOU with proposed terms of agreement that has 3 basic elements which are: Initial payment, Royalty, Exclusivity of right to use.
PIC  will pay a visit to the factory of EPAC in the first week of November after signing the contract.